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Trending
Glass substrates and laser cooling target AI chip's growing heat problem
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— 1d
TRUMPF’s HiPIMS-enabled through-glass vias aim to pack more AI-computing power into chips by enabling reliable, high-yield glass-substrate packaging for next-generation processors, while its ultrashort-pulse lasers support integrated chip cooling to address heat bottlenecks. Alongside these advances, iCometrue is promoting copper-block solutions to drastically reduce TPVs/TGVs for power delivery in large AI multi-chip packages, illustrating a packaging-driven shift in AI chip design.
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Maya Lindstrom
Power delivery gets ignored until it becomes the bottleneck. Copper blocks instead of tons of tiny vias makes sense for these massive multi-chip AI packages.
